Deposition of Au-Cu Alloy Films by RF Ion Plating.
نویسندگان
چکیده
منابع مشابه
Low energy ion assisted deposition of Ta/Cu films
A combination of molecular dynamics simulations and experiments has been used to investigate the use of various low energy ion assisted vapor deposition approaches for controlling the interfacial structures of a model copper/tantalum multilayer system. Films were grown using argon ion beam assistance with either a fixed or modulated ion energy during metal deposition. The effect of sequential i...
متن کاملEthylene binding to Au/Cu alloy nanoparticles
a Materials Science and Engineering Program, The University of Texas at Austin, Austin, TX 78712, United States b Department of Chemistry and the Institute for Computational Engineering and Sciences, The University of Texas at Austin, Austin, TX 78712, United States c Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX 78712, United States d Departme...
متن کاملComparative study of IR and UV laser damage resistance of silica thin films deposited by Electron Beam deposition, Ion Plating, Ion Assisted Deposition and Dual Ion Beam Sputtering
The laser damage resistance of optical coatings is a critical point for a large number of applications. However improving this resistance is often hard to obtain because of the large number of parameters in the deposition processes than can modify the laser damage threshold and the lack of detailed and exploitable studies published on this subject. Then, the aim of this work is to test and anal...
متن کاملLaser damage resistance of silica thin films deposited by Electron Beam Deposition, Ion Assisted Deposition, Reactive Low Voltage Ion Plating and Dual Ion Beam Sputtering
The laser damage resistance of optical coatings is a key point for a large number of applications. The aim of this work is to test and analyze the laser damage resistance of a thin film material commonly used for high power applications (SiO2) and deposited with different techniques: Electron Beam Deposition, Ion Assisted Deposition, Low Voltage Reactive Ion Plating and Dual Ion Beam Sputtering...
متن کاملSTM characterization of Cu thin films grown by direct ion deposition
In certain cases, the incidence energy of constituent atoms activates an atomistic insertion mechanism, which decreases the surface roughness of metal thin films. In an effort to probe this effect, homoepitaxial copper films were grown using a mass/energy selected direct ion deposition technique that allows precise control of the incidence energy. Surface roughness is measured using a Scanning ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1999
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.50.738